Plugin Platform Package
Total support from prototype to mass production. We provide highly reliable products.
◆Overview The plugin platform package is made of metal and glass, featuring excellent airtightness and insulation, and is used as a Dual In-Line Package (DIP) for insertion mounting on printed circuit boards. ◆Features - It can be supplied as a set with a cover (cap). - A representative overview diagram is provided below, but we also offer custom design and manufacturing, so please consult us separately. ◆Main Specifications Airtightness: 1×10^-9 Pa·m³/sec or less Insulation Resistance: 1000 MΩ or more at DC 500V between base and lead wires Finish: Ni-Ep / Ni-Elp + Au-Ep ★ For more details, please request documentation or download the catalog ★
- 企業：フジ電科
- 価格：Other
